Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers

The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to...

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Main Author: Mohd Supian, Norazlina
Format: Thesis
Language:English
Published: 2018
Subjects:
Online Access:http://eprints.usm.my/61209/
http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf
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author Mohd Supian, Norazlina
author_facet Mohd Supian, Norazlina
author_sort Mohd Supian, Norazlina
building USM Institutional Repository
collection Online Access
description The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to presence of many integrated component such as transistor, internal resistor, etc on a single die. Hence the evaluation of IC drivers with single or multiple heat sources is absolutely necessary for imparting suitable thermal management within the device. In this study, thermal transient measurement method and computational fluid dynamics (CFD) simulations have been used to measure thermal resistance and junction temperature.
first_indexed 2025-11-15T19:10:02Z
format Thesis
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institution Universiti Sains Malaysia
institution_category Local University
language English
last_indexed 2025-11-15T19:10:02Z
publishDate 2018
recordtype eprints
repository_type Digital Repository
spelling usm-612092024-09-24T07:17:30Z http://eprints.usm.my/61209/ Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers Mohd Supian, Norazlina TK7800-8360 Electronics The thermal behaviour of an electronic package is often characterized by evaluating the junction temperature and thermal resistance at the junction of a single or multiple heat source to ambient. In the case of IC LED drivers, the heat source within the device is either single or multiple due to presence of many integrated component such as transistor, internal resistor, etc on a single die. Hence the evaluation of IC drivers with single or multiple heat sources is absolutely necessary for imparting suitable thermal management within the device. In this study, thermal transient measurement method and computational fluid dynamics (CFD) simulations have been used to measure thermal resistance and junction temperature. 2018-09 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf Mohd Supian, Norazlina (2018) Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers. Masters thesis, Universiti Sains Malaysia.
spellingShingle TK7800-8360 Electronics
Mohd Supian, Norazlina
Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title_full Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title_fullStr Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title_full_unstemmed Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title_short Simulation And Performance Studies Of Thermally Efficient Light Emitting Diodes Drivers
title_sort simulation and performance studies of thermally efficient light emitting diodes drivers
topic TK7800-8360 Electronics
url http://eprints.usm.my/61209/
http://eprints.usm.my/61209/1/Simulation%20and%20performance%20studies%20cut.pdf