APA (7th ed.) Citation

Ong, E. S. (2013). Analysis Of Plastic Encapsulation Process In 3D IC Package With Through-Silicon Via (Tsv) Technology.

Chicago Style (17th ed.) Citation

Ong, Ern Seang. Analysis Of Plastic Encapsulation Process In 3D IC Package With Through-Silicon Via (Tsv) Technology. 2013.

MLA (9th ed.) Citation

Ong, Ern Seang. Analysis Of Plastic Encapsulation Process In 3D IC Package With Through-Silicon Via (Tsv) Technology. 2013.

Warning: These citations may not always be 100% accurate.