Chek, M. A. W. (2019). Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Universiti Sains Malaysia.
Chicago Style (17th ed.) CitationChek, Muhammad Asyraf Wan. Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Universiti Sains Malaysia, 2019.
MLA (9th ed.) CitationChek, Muhammad Asyraf Wan. Structural And Reliability Analysis Of Solder Joint Under Vibration Loading. Universiti Sains Malaysia, 2019.
Warning: These citations may not always be 100% accurate.