Modelling Of Mechanical Behaviour Of Electronics Materials

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Modelling Of Mechanical Behaviour Of Electronics Materials

Lead free solder Sn-Ag-Cu is investigated and studied to replace the leaded solder after the usage of lead components has been limited by Europe Union through the Restriction of Hazardous Substance (RoHS). Due to constant push on miniaturization in electronic package, strength of solder joint of ele...

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Bibliographic Details
Main Author:	Fun, Seng Phan
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2019
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/58428/ http://eprints.usm.my/58428/1/Modelling%20Of%20Mechanical%20Behaviour%20Of%20Electronics%20Materials.pdf

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