Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering

Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering

Consumer electronics market is one of the fastest growing markets in the world. Flip chip (FC) technology is one of the technologies for interconnecting semiconductor devices, and with the demand for shrinking in footprint of electronic packages, FC technology must handle the increase in I/O interco...

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Bibliographic Details
Main Author: Chong, Jia Jun
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2019
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/58414/
http://eprints.usm.my/58414/1/Influence%20Of%20Copper%20Pillar%20Bump%20Structure%20On%20Flip%20Chip%20Packaging%20During%20Reflow%20Soldering.pdf

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