APA (7th ed.) Citation

Chong, J. J. (2019). Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering. Universiti Sains Malaysia.

Chicago Style (17th ed.) Citation

Chong, Jia Jun. Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering. Universiti Sains Malaysia, 2019.

MLA (9th ed.) Citation

Chong, Jia Jun. Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering. Universiti Sains Malaysia, 2019.

Warning: These citations may not always be 100% accurate.