Thermal Management In Stacked Dies

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Thermal Management In Stacked Dies

The present trend in integrated circuit (IC) packaging, geared towards reduction in size and higher functionality in IC packages, has called about the need for integrating dies vertically in a single package. Added functionality and capacity of stacked dies packages within the same footprint a...

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Bibliographic Details
Main Author:	Norman, Hua Shijie
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2005
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/58206/ http://eprints.usm.my/58206/1/Thermal%20Management%20In%20Stacked%20Dies_Norman%20Hua%20Shijie.pdf

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