Thermal Management In Stacked Dies
The present trend in integrated circuit (IC) packaging, geared towards reduction in size and higher functionality in IC packages, has called about the need for integrating dies vertically in a single package. Added functionality and capacity of stacked dies packages within the same footprint a...
| Main Author: | |
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2005
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| Online Access: | http://eprints.usm.my/58206/ http://eprints.usm.my/58206/1/Thermal%20Management%20In%20Stacked%20Dies_Norman%20Hua%20Shijie.pdf |
| _version_ | 1848883836161622016 |
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| author | Norman, Hua Shijie |
| author_facet | Norman, Hua Shijie |
| author_sort | Norman, Hua Shijie |
| building | USM Institutional Repository |
| collection | Online Access |
| description | The present trend in integrated circuit (IC) packaging, geared towards reduction in size
and higher functionality in IC packages, has called about the need for integrating dies
vertically in a single package. Added functionality and capacity of stacked dies packages
within the same footprint as a single die package practically means higher power densities
packages, and this is where thermal issues arise. Through the present study, it is of utmost
interest to determine how the temperature and stress distribution within the package varies
with the different loads of power applied in the silicon dies. The findings from the present
study are of in-depth meaning particularly in the thermal management aspect because the
challenge arises in attempting to remove heat efficiently from stacked dies packages. The
research study is facilitated with ANSYSTM 7.0, which is used as a finite element modelling
and analysis tool. The temperature and stress distribution in stacked dies packages under
different source power is studied. Thermal stresses are induced in the package as a result of
mismatch in the coefficient of thermal expansion (CTE) properties of the various package
materials. Warpage of the package is to be limited to avoid the loss of electrical and
mechanical connections. For all cases, the junction temperature and stress increases linearly
with total power generation rates in the package. The junction temperature in each package is
found to be independent of the power splitting ratios among the dies. The increment in
junction temperature with respect to total power decreases from the single die package to the
four stacked dies package. The printed circuit board provides a conduction path for effective
heat removal from the bottom of the package to ambient as proven from the simulation results. |
| first_indexed | 2025-11-15T18:57:08Z |
| format | Monograph |
| id | usm-58206 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:57:08Z |
| publishDate | 2005 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-582062023-04-26T01:56:44Z http://eprints.usm.my/58206/ Thermal Management In Stacked Dies Norman, Hua Shijie T Technology TJ Mechanical engineering and machinery The present trend in integrated circuit (IC) packaging, geared towards reduction in size and higher functionality in IC packages, has called about the need for integrating dies vertically in a single package. Added functionality and capacity of stacked dies packages within the same footprint as a single die package practically means higher power densities packages, and this is where thermal issues arise. Through the present study, it is of utmost interest to determine how the temperature and stress distribution within the package varies with the different loads of power applied in the silicon dies. The findings from the present study are of in-depth meaning particularly in the thermal management aspect because the challenge arises in attempting to remove heat efficiently from stacked dies packages. The research study is facilitated with ANSYSTM 7.0, which is used as a finite element modelling and analysis tool. The temperature and stress distribution in stacked dies packages under different source power is studied. Thermal stresses are induced in the package as a result of mismatch in the coefficient of thermal expansion (CTE) properties of the various package materials. Warpage of the package is to be limited to avoid the loss of electrical and mechanical connections. For all cases, the junction temperature and stress increases linearly with total power generation rates in the package. The junction temperature in each package is found to be independent of the power splitting ratios among the dies. The increment in junction temperature with respect to total power decreases from the single die package to the four stacked dies package. The printed circuit board provides a conduction path for effective heat removal from the bottom of the package to ambient as proven from the simulation results. Universiti Sains Malaysia 2005-03-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/58206/1/Thermal%20Management%20In%20Stacked%20Dies_Norman%20Hua%20Shijie.pdf Norman, Hua Shijie (2005) Thermal Management In Stacked Dies. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted) |
| spellingShingle | T Technology TJ Mechanical engineering and machinery Norman, Hua Shijie Thermal Management In Stacked Dies |
| title | Thermal Management In Stacked Dies |
| title_full | Thermal Management In Stacked Dies |
| title_fullStr | Thermal Management In Stacked Dies |
| title_full_unstemmed | Thermal Management In Stacked Dies |
| title_short | Thermal Management In Stacked Dies |
| title_sort | thermal management in stacked dies |
| topic | T Technology TJ Mechanical engineering and machinery |
| url | http://eprints.usm.my/58206/ http://eprints.usm.my/58206/1/Thermal%20Management%20In%20Stacked%20Dies_Norman%20Hua%20Shijie.pdf |