FEA MEMS Packaging For Sensor
Mechanical characteristics of a sensor microbeam based on resonance frequency for gas detection and their dependence on the geometry and materials is investigated in this paper. These microbeam structures will be modeled in Finite Element Analysis software (ANSYS 7.0). The microbeam structu...
| Main Author: | Abdullah@Muhamad, Maswandy |
|---|---|
| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2005
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/58170/ http://eprints.usm.my/58170/1/Fea%20MEMS%20Packaging%20For%20Sensor_Maswandy%20Abdullah%40Muhamad.pdf |
Similar Items
Mems In Control Tower
by: Ramli, Mohd Akmal
Published: (2018)
by: Ramli, Mohd Akmal
Published: (2018)
Effects of punching force on cutting tool in forming process using FEA approach
by: Ahmad Khairul Hafizi, Wahab
Published: (2009)
by: Ahmad Khairul Hafizi, Wahab
Published: (2009)
Design And Fabrication Of Flexible Strain Sensor For Food Packaging
by: Abdul Aziz, Siti Nuha Majiddah
Published: (2022)
by: Abdul Aziz, Siti Nuha Majiddah
Published: (2022)
Benchmark Analysis Of Heat Conduction Problems With Adaptive Fea Code Polyde
by: Jerome, Lee Jie Jen
Published: (2017)
by: Jerome, Lee Jie Jen
Published: (2017)
Simulation Of Flexible Capacitive Strain Sensor For Food Packaging Applications
by: Salleh, Muhammad Safwan
Published: (2022)
by: Salleh, Muhammad Safwan
Published: (2022)
Failure analysis of pipe joint spiral wound gasket using finite element analysis (FEA)
by: Zainulariffin, Awang
Published: (2010)
by: Zainulariffin, Awang
Published: (2010)
Simulation study of biomechanical properties of porous titanium alloy spinal cage using ct-fea
by: Muhammad Shahruddin, Azmi
Published: (2024)
by: Muhammad Shahruddin, Azmi
Published: (2024)
Effects of Spot Diameter and Sheets Thickness on Fatigue Life of Spot Welded Structure based on FEA Approach
by: M. M., Rahman, et al.
Published: (2009)
by: M. M., Rahman, et al.
Published: (2009)
An Investigation into the Effects of Spot Diameter and Sheets Thickness on Fatigue Life of Spot Welded Structure Based on Fea
by: M. M., Noor, et al.
Published: (2008)
by: M. M., Noor, et al.
Published: (2008)
Finite Element Analysis Of An Actuator In MEMS Application
by: Ce Ku Zanggi, Che Ku Mohd Arif
Published: (2005)
by: Ce Ku Zanggi, Che Ku Mohd Arif
Published: (2005)
Virtual Laser-micromachining of MEMS Components
by: M. F. F., Ab Rashid, et al.
Published: (2009)
by: M. F. F., Ab Rashid, et al.
Published: (2009)
Cutting Force prediction model by FEA and RSM when machining Hastelloy C-2HS with 900 holder
by: K., Kadirgama, et al.
Published: (2008)
by: K., Kadirgama, et al.
Published: (2008)
Polymeric spinal cage developed via ct-fea
by: Muhammad Hilmi, Jalil, et al.
Published: (2021)
by: Muhammad Hilmi, Jalil, et al.
Published: (2021)
CT-FEA of inhomogeneous lumbar with different loadings of the spinal cage
by: Muhammad Shahruddin, Azmi, et al.
Published: (2023)
by: Muhammad Shahruddin, Azmi, et al.
Published: (2023)
Dynamic characterization of car door and hood panels using FEA and EMA
by: Hanouf, Zahir, et al.
Published: (2014)
by: Hanouf, Zahir, et al.
Published: (2014)
Feasible laser parameter in fabrication of MEMS structure on PMMA
by: Loh, Simon Hock Hua
Published: (2010)
by: Loh, Simon Hock Hua
Published: (2010)
Feasible laser parameters in fabrication of MEMS structures on silicon
by: Yong, Chee Ping
Published: (2010)
by: Yong, Chee Ping
Published: (2010)
Numerical analysis of MEMS structures with accelerated motion effects
by: Shafrida, Sahrani
Published: (2007)
by: Shafrida, Sahrani
Published: (2007)
Kajian pembentukan tegasan dan anjakan pada matalat pemotong disebabkan oleh parameter pemotong menggunakan kaedah unsur tak terhingga (FEA)
by: Mohd. Saad, Rozaimi
Published: (2003)
by: Mohd. Saad, Rozaimi
Published: (2003)
Design and modeling of silicon MEMS accelerometer
by: Hrairi, Meftah, et al.
Published: (2011)
by: Hrairi, Meftah, et al.
Published: (2011)
Focused ion beam micromachining of mems
by: Ali, Mohammad Yeakub
Published: (2008)
by: Ali, Mohammad Yeakub
Published: (2008)
Prediction of burr formation in fabricating MEMS components by micro end milling
by: Ali, Mohammad Yeakub, et al.
Published: (2009)
by: Ali, Mohammad Yeakub, et al.
Published: (2009)
Parametric transition as a spiral curve and its application in spur gear tooth with FEA
by: Yahaya, S.H, et al.
Published: (2011)
by: Yahaya, S.H, et al.
Published: (2011)
Prediction of burr formation in fabricating MEMS components by micro end milling
by: Ali, Mohammad Yeakub, et al.
Published: (2009)
by: Ali, Mohammad Yeakub, et al.
Published: (2009)
Mould Filling In Electronic Packaging
by: Heng, Chai Wei
Published: (2005)
by: Heng, Chai Wei
Published: (2005)
Simulation On Chip Scale Packaging
by: Dorai Raj, Nanthakumar
Published: (2000)
by: Dorai Raj, Nanthakumar
Published: (2000)
Mould Filling In Electronic Packaging
by: Chu, Wee Liang
Published: (2004)
by: Chu, Wee Liang
Published: (2004)
A wideband reconfigurable folded planar dipole using MEMS and hybrid polymeric substrates
by: H., Lago, et al.
Published: (2019)
by: H., Lago, et al.
Published: (2019)
Fabrication of Bio-MEMS Nanostructure by focused ion beam
by: Ali, Mohammad Yeakub, et al.
Published: (2010)
by: Ali, Mohammad Yeakub, et al.
Published: (2010)
Development of micro end milling process for fabricating MEMS
by: Ali, Mohammad Yeakub
Published: (2009)
by: Ali, Mohammad Yeakub
Published: (2009)
Fast Steady-State And Transient Analyses Of
Mems Devices
by: Loh , Jit Seng
Published: (2010)
by: Loh , Jit Seng
Published: (2010)
High aspect ratio microfilling for MEMS using metal nanopowder / Fatin Syazana Jamaludin
by: Fatin Syazana , Jamaludin
Published: (2013)
by: Fatin Syazana , Jamaludin
Published: (2013)
Dynamic characterisation of car door and hood panels using FEA and EMA
by: Hanouf, Zahir, et al.
Published: (2014)
by: Hanouf, Zahir, et al.
Published: (2014)
Multipurpose automatic Kerisik packaging machine
by: Sukarman, Muhammad Izwan, et al.
Published: (2017)
by: Sukarman, Muhammad Izwan, et al.
Published: (2017)
One-dimensional analysis of thermoelement exposed to lateral heat transfer as a wall in MEMS-based thermoelectrically controlled micronozzle
by: Hameed, Ammar, et al.
Published: (2012)
by: Hameed, Ammar, et al.
Published: (2012)
One dimensional analysis of thermoelement exposed to lateral heat transfer as a wall in MEMS-Based thermoelectrically controlled micronozzle
by: Mohammed Idres, Moumen, et al.
Published: (2011)
by: Mohammed Idres, Moumen, et al.
Published: (2011)
Minimum chip thickness in machining MEMS structure using Tool Based Micromilling
by: Ali, Mohammad Yeakub, et al.
Published: (2011)
by: Ali, Mohammad Yeakub, et al.
Published: (2011)
Mechanism-based reliability model for electronic packages
by: Ng, Chee Weng
Published: (2005)
by: Ng, Chee Weng
Published: (2005)
Influence Of Copper Pillar Bump Structure On Flip Chip Packaging During Reflow Soldering
by: Chong, Jia Jun
Published: (2019)
by: Chong, Jia Jun
Published: (2019)
Modal analysis of an 8/6 pole switched reluctance motor core with different materials and assembly method using FEA
by: Rosli, Danial N., et al.
Published: (2022)
by: Rosli, Danial N., et al.
Published: (2022)
Similar Items
-
Mems In Control Tower
by: Ramli, Mohd Akmal
Published: (2018) -
Effects of punching force on cutting tool in forming process using FEA approach
by: Ahmad Khairul Hafizi, Wahab
Published: (2009) -
Design And Fabrication Of Flexible Strain Sensor For Food Packaging
by: Abdul Aziz, Siti Nuha Majiddah
Published: (2022) -
Benchmark Analysis Of Heat Conduction Problems With Adaptive Fea Code Polyde
by: Jerome, Lee Jie Jen
Published: (2017) -
Simulation Of Flexible Capacitive Strain Sensor For Food Packaging Applications
by: Salleh, Muhammad Safwan
Published: (2022)