APA (7th ed.) Citation

Heng, C. W. (2005). Mould Filling In Electronic Packaging. Universiti Sains Malaysia.

Chicago Style (17th ed.) Citation

Heng, Chai Wei. Mould Filling In Electronic Packaging. Universiti Sains Malaysia, 2005.

MLA (9th ed.) Citation

Heng, Chai Wei. Mould Filling In Electronic Packaging. Universiti Sains Malaysia, 2005.

Warning: These citations may not always be 100% accurate.