Mould Filling In Electronic Packaging

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Mould Filling In Electronic Packaging

This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transf...

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Bibliographic Details
Main Author:	Chu, Wee Liang
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2004
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/57100/ http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf

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