Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transf...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2004
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| Online Access: | http://eprints.usm.my/57100/ http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf |
| _version_ | 1848883533408370688 |
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| author | Chu, Wee Liang |
| author_facet | Chu, Wee Liang |
| author_sort | Chu, Wee Liang |
| building | USM Institutional Repository |
| collection | Online Access |
| description | This final year project focuses on the study of flow in encapsulation processes in electronic
packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of
Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from
transfer ram in the transfer molding process. The velocity field obtained from both
Hele-Shaw and generalized porous medium approaches is used in pseudo-concentration
algorithm for front tracking with an artificial diffusion term added to allow partial slip at
the fluid-wall interface and to damp numerical oscillation to a minimum level. Finite
Element Method is employed in all the analyses to reduce the governing partial differential
equations to algebraic equations. Parametric studies had been carried out to study how the
dimension and parameter of the mold tools affects the flow filling’s behavior. From
parametric study we can show that by altering the dimensions of mold tools, thus
introducing different hydraulic resistances at various in-line cavities in appropriate
proportions, will lead to balance filling in transfer molding. |
| first_indexed | 2025-11-15T18:52:19Z |
| format | Monograph |
| id | usm-57100 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:52:19Z |
| publishDate | 2004 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-571002023-02-28T09:50:17Z http://eprints.usm.my/57100/ Mould Filling In Electronic Packaging Chu, Wee Liang T Technology TJ Mechanical engineering and machinery This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transfer molding process. The velocity field obtained from both Hele-Shaw and generalized porous medium approaches is used in pseudo-concentration algorithm for front tracking with an artificial diffusion term added to allow partial slip at the fluid-wall interface and to damp numerical oscillation to a minimum level. Finite Element Method is employed in all the analyses to reduce the governing partial differential equations to algebraic equations. Parametric studies had been carried out to study how the dimension and parameter of the mold tools affects the flow filling’s behavior. From parametric study we can show that by altering the dimensions of mold tools, thus introducing different hydraulic resistances at various in-line cavities in appropriate proportions, will lead to balance filling in transfer molding. Universiti Sains Malaysia 2004-02-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf Chu, Wee Liang (2004) Mould Filling In Electronic Packaging. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted) |
| spellingShingle | T Technology TJ Mechanical engineering and machinery Chu, Wee Liang Mould Filling In Electronic Packaging |
| title | Mould Filling In Electronic Packaging |
| title_full | Mould Filling In Electronic Packaging |
| title_fullStr | Mould Filling In Electronic Packaging |
| title_full_unstemmed | Mould Filling In Electronic Packaging |
| title_short | Mould Filling In Electronic Packaging |
| title_sort | mould filling in electronic packaging |
| topic | T Technology TJ Mechanical engineering and machinery |
| url | http://eprints.usm.my/57100/ http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf |