The Effect Of Adding Silver Nanoparticles In Tin Surface Finish Electroplated With Ultrasonication On Wettability And Strength Of SAC305 Solder Joint

The Effect Of Adding Silver Nanoparticles In Tin Surface Finish Electroplated With Ultrasonication On Wettability And Strength Of SAC305 Solder Joint

The development of electronic packaging has introduced various types of surface finish on copper substrate to improve bonding performance of solder. This affects the soldering and the intermetallic compound that formed at the solder/substrate interface which eventually influence the reliability of...

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Bibliographic Details
Main Author: Tneh, Kin Man
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2022
Subjects:
T Technology
TN Mining Engineering. Metallurgy
Online Access:http://eprints.usm.my/56648/
http://eprints.usm.my/56648/1/The%20Effect%20Of%20Adding%20Silver%20Nanoparticles%20In%20Tin%20Surface%20Finish%20Electroplated%20With%20Ultrasonication%20On%20Wettability%20And%20Strength%20Of%20SAC305%20Solder%20Joint_Tneh%20Kin%20Man.pdf

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