Determination Of Fracture Toughness
In PBGA Packages Using Finite Element And
Experimental Methods

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Determination Of Fracture Toughness In PBGA Packages Using Finite Element And Experimental Methods

Electronic packages especially the plastic ball grid array (PBGA) has its unique crack failure arising from the soldering process. The existence of moisture absorbed in package from ambient condition causes vapor pressure. During reflow soldering processes (215°C), the moisture absorbed vaporizes...

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Bibliographic Details
Main Author:	Tan, Chew Pheng
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TA1-2040 Engineering (General). Civil engineering (General)
Online Access:	http://eprints.usm.my/56293/ http://eprints.usm.my/56293/1/00001671787%20TCP.pdf

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