Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs

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Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs

For decades, multilayer circuit boards have been often used in the electronic industry, and their application in electronic devices has been crucial and rising in recent years. It has the advantages of mobility, weight, and flexibility. Although the analysis of delamination bending has long existe...

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Bibliographic Details
Main Author:	Zulkifli, Ahmad Fazlullah
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2022
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55972/ http://eprints.usm.my/55972/1/Finite%20Element%20Analysis%20Of%20Bending%20Delamination%20In%20Multilayer%20Circuit%20Boards%20Pcbs_Ahmad%20Fazlullah%20Zulkifli.pdf

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