APA (7th ed.) Citation

Zulkifli, A. F. (2022). Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs. Universiti Sains Malaysia.

Chicago Style (17th ed.) Citation

Zulkifli, Ahmad Fazlullah. Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs. Universiti Sains Malaysia, 2022.

MLA (9th ed.) Citation

Zulkifli, Ahmad Fazlullah. Finite Element Analysis Of Bending Delamination In Multilayer Circuit Boards PCBs. Universiti Sains Malaysia, 2022.

Warning: These citations may not always be 100% accurate.