FEM Simulation on Stencil Bending Due to Squeegee Load during Solder Paste Stencil Printing Process

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FEM Simulation on Stencil Bending Due to Squeegee Load during Solder Paste Stencil Printing Process

In the assembly of the printed circuit board, the squeegee moves in one direction with the application of load on the squeegee. This will result from the squeegee deflect the stencil and Printed Circuit Board (PCB) throughout the stencil printing process. This loading creates micro-bending on the st...

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Bibliographic Details
Main Author:	Azlee, Muhammad Haziq
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2021
Subjects:	T Technology TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55966/ http://eprints.usm.my/55966/1/FEM%20Simulation%20on%20Stencil%20Bending%20Due%20to%20Squeegee%20Load%20during%20Solder%20Paste%20Stencil%20Printing%20Process.pdf

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