Investigation Of Gold Wire Attachment During Led Encapsulation Process Using Computational Fluid Dynamic

Investigation Of Gold Wire Attachment During Led Encapsulation Process Using Computational Fluid Dynamic

The aim of this research is to investigate the LED encapsulation method and the interaction of gold wire bonding with EMC. The encapsulation process is important because it serves as the LED’s first layer of protection. As noted in the preceding study, the encapsulating process has an impact on prod...

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Bibliographic Details
Main Author: Sahabarudin, Mohammad Nor Fikri
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2021
Subjects:
T Technology
TJ1-1570 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/55884/
http://eprints.usm.my/55884/1/Investigation%20Of%20Gold%20Wire%20Attachment%20During%20Led%20Encapsulation%20Process%20Using%20Computational%20Fluid%20Dynamic.pdf

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