Nanoindentation Of Copper Thin Film On Silicon Substrates

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Nanoindentation Of Copper Thin Film On Silicon Substrates

In this day, metallization has shifted to copper because of its high electrical and thermal conductivity, greater melting temperature, and lower rate of diffusivity compared to other metals. In this study, nanoindentation method is used to examine the mechanical characteristics of thin copper film w...

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Bibliographic Details
Main Author:	Zalkapli, Muhammad Amir
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2022
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55869/ http://eprints.usm.my/55869/1/Nanoindentation%20Of%20Copper%20Thin%20Film%20On%20Silicon%20Substrates_Muhammad%20Amir%20Zalkapli.pdf

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