Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing
The electronic sector is developing novel products that are smaller and faster, with better performance, a lighter container, and are more cost effective. An integrated circuit can be used to link several LEDs with different functions to electronic devices packaged. The area between the cover len...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2021
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| Online Access: | http://eprints.usm.my/55795/ http://eprints.usm.my/55795/1/Experimental%20Investigation%20On%20The%20Effect%20Of%20Epoxy%20On%20The%20Encapsulation%20Process%20In%20Light%20Emitting%20Diode%20Manufacturing.pdf |
| _version_ | 1848883180844613632 |
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| author | Muniary, Kaalidass |
| author_facet | Muniary, Kaalidass |
| author_sort | Muniary, Kaalidass |
| building | USM Institutional Repository |
| collection | Online Access |
| description | The electronic sector is developing novel products that are smaller and faster, with better
performance, a lighter container, and are more cost effective. An integrated circuit can be used
to link several LEDs with different functions to electronic devices packaged. The area between
the cover lens and the LED chip is filled with a non-conductive polymeric substance, which is
commonly epoxy or transparent silicone encapsulant. The purpose of encapsulation is to shield
the device from mechanical effects that could weaken the connection between the chip and the
substrate. The research is focussing on experimental investigation on the effect of epoxy on the
encapsulation process in LED. The different parameters that effect the encapsulation process,
such as needle size, type of epoxy resin and method of curing have been studied. The contact
angle, contact surface area and hardness of each type of epoxy were measured after the curing
process. The three types of epoxy resin with the hardener are injected onto the wafer substrate
manually with a syringe and five types of needle size. The contact angle and surface area of
contact measurement were done by the ImageJ software and hardness test in the
nanoindentation lab. The experimental results showed the 1:1 self-curing epoxy resin is the
most efficient type of epoxy resin as it has the relevant values for contact angles and surface
area of contact. The 21G needle size was chosen as the suitable size for the encapsulation
process. The selection of the right epoxy is determined by the contact angle and surface area
of contact measurements for this project. The hardness test was conducted for the oven curing
epoxy resin. |
| first_indexed | 2025-11-15T18:46:43Z |
| format | Monograph |
| id | usm-55795 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:46:43Z |
| publishDate | 2021 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-557952022-11-29T04:18:58Z http://eprints.usm.my/55795/ Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing Muniary, Kaalidass T Technology TJ1-1570 Mechanical engineering and machinery The electronic sector is developing novel products that are smaller and faster, with better performance, a lighter container, and are more cost effective. An integrated circuit can be used to link several LEDs with different functions to electronic devices packaged. The area between the cover lens and the LED chip is filled with a non-conductive polymeric substance, which is commonly epoxy or transparent silicone encapsulant. The purpose of encapsulation is to shield the device from mechanical effects that could weaken the connection between the chip and the substrate. The research is focussing on experimental investigation on the effect of epoxy on the encapsulation process in LED. The different parameters that effect the encapsulation process, such as needle size, type of epoxy resin and method of curing have been studied. The contact angle, contact surface area and hardness of each type of epoxy were measured after the curing process. The three types of epoxy resin with the hardener are injected onto the wafer substrate manually with a syringe and five types of needle size. The contact angle and surface area of contact measurement were done by the ImageJ software and hardness test in the nanoindentation lab. The experimental results showed the 1:1 self-curing epoxy resin is the most efficient type of epoxy resin as it has the relevant values for contact angles and surface area of contact. The 21G needle size was chosen as the suitable size for the encapsulation process. The selection of the right epoxy is determined by the contact angle and surface area of contact measurements for this project. The hardness test was conducted for the oven curing epoxy resin. Universiti Sains Malaysia 2021-07-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/55795/1/Experimental%20Investigation%20On%20The%20Effect%20Of%20Epoxy%20On%20The%20Encapsulation%20Process%20In%20Light%20Emitting%20Diode%20Manufacturing.pdf Muniary, Kaalidass (2021) Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted) |
| spellingShingle | T Technology TJ1-1570 Mechanical engineering and machinery Muniary, Kaalidass Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title | Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title_full | Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title_fullStr | Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title_full_unstemmed | Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title_short | Experimental Investigation On The Effect Of Epoxy On The Encapsulation Process In Light Emitting Diode Manufacturing |
| title_sort | experimental investigation on the effect of epoxy on the encapsulation process in light emitting diode manufacturing |
| topic | T Technology TJ1-1570 Mechanical engineering and machinery |
| url | http://eprints.usm.my/55795/ http://eprints.usm.my/55795/1/Experimental%20Investigation%20On%20The%20Effect%20Of%20Epoxy%20On%20The%20Encapsulation%20Process%20In%20Light%20Emitting%20Diode%20Manufacturing.pdf |