Influence Of Epoxy Viscosity And Gold Wire Size On Led Encapsulation Process
There are a few issues experienced in high-power LED applications that severely influence the reliability of the LEDs. One of the most problems of the LED failure is wire deformation or wire sweep during the encapsulation process that can indirectly affect the LED life expectancy. The goal of this s...
| Main Author: | Goh, Wei Shing |
|---|---|
| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2021
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/55787/ http://eprints.usm.my/55787/1/Influence%20Of%20Epoxy%20Viscosity%20And%20Gold%20Wire%20Size%20On%20Led%20Encapsulation%20Process.pdf |
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