Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process

Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process

A typical element found in electronic assemblies and devices is the multi-layered ceramic capacitor (MLCC). However, MLCC mechanical defects such as voiding, cracking, and delamination would significantly reduce the device's usefulness, dependability, and longevity. This mechanical defect is on...

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Bibliographic Details
Main Author: Raja Gobal, Hehgeraj
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2022
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/55718/
http://eprints.usm.my/55718/1/Study%20Of%20Deformation%20And%20Crack%20Propagation%20On%20Component%20During%20Reflow%20Soldering%20Process_Hehgeraj%20Raja%20Gobal.pdf

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