APA (7th ed.) Citation

Raja Gobal, H. (2022). Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia.

Chicago Style (17th ed.) Citation

Raja Gobal, Hehgeraj. Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia, 2022.

MLA (9th ed.) Citation

Raja Gobal, Hehgeraj. Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia, 2022.

Warning: These citations may not always be 100% accurate.