Simulation Of Flexible Capacitive Strain Sensor For Food Packaging Applications

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Simulation Of Flexible Capacitive Strain Sensor For Food Packaging Applications

Due to the variety of uses for strain sensors, there is a growing demand for flexible, affordable, and low-power devices for strain. This paper presents the simulation of the flexible Interdigitated Capacitive (IDC) strain sensor for food packaging applications. In the food packaging application, th...

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Bibliographic Details
Main Author:	Salleh, Muhammad Safwan
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2022
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55593/ http://eprints.usm.my/55593/1/Simulation%20Of%20Flexible%20Capacitive%20Strain%20Sensor%20For%20Food%20Packaging%20Applications_Muhammad%20Safwan%20Salleh.pdf

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