Structural Integrity Investigation Of SAC305 Lead Free Solder

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Structural Integrity Investigation Of SAC305 Lead Free Solder

Improvement in solder strength is instantly becoming one of the most important concerns in the electronics industry, particularly in Printed Circuit Board (PCB) applications. Because of the design and mounting of electronic components on a substrate or PCB, solder in electronic connections may crack...

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Bibliographic Details
Main Author:	Ganiashan, Eesvaran
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2022
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55559/ http://eprints.usm.my/55559/1/Structural%20Integrity%20Investigation%20Of%20SAC305%20Lead%20Free%20Solder_Eesvaran%20Ganiashan.pdf

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