Vibration-Fatigue Assessment On Electronics Interconnections

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Vibration-Fatigue Assessment On Electronics Interconnections

Many devices consist of electronic parts and can be operated in a certain vibration environment for some instant without undergoing failure. Interconnection or joint plays a very important role in electronic devices to connect various electrical and mechanical parts altogether. Electrically conducti...

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Bibliographic Details
Main Author:	Wong, Zie Jen
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2022
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/55536/ http://eprints.usm.my/55536/1/Vibration-Fatigue%20Assessment%20On%20Electronics%20Interconnections_Wong%20Zie%20Jen.pdf

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