Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation

Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation

The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solde...

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Bibliographic Details
Main Author: Zahit, Mohd Amier Hasief Mat
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
TJ1 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54408/
http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf

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