Structural Analysis Of Stretchable Electronics Joint Under Tensile And Vibration Loading

Structural Analysis Of Stretchable Electronics Joint Under Tensile And Vibration Loading

Solder joint is the major part of electronic devices to form an electrical connection and mechanical bond. Thus, study of electronics joint reliability is significant to determine the ability of the interconnection to maintain its functionality under subjected environments. Reliability of electronic...

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Bibliographic Details
Main Author: Mustaffa, Nadirah
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54406/
http://eprints.usm.my/54406/1/Structural%20Analysis%20Of%20Stretchable%20Electronics%20Joint%20Under%20Tensile%20And%20Vibration%20Loading_Nadirah%20Mustaffa_M4_2017.pdf

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