Stress Analysis Of Stretchable Thermal Sensor
This paper present a summary of the performance of modelling for stretchable circuit. For this new technology, the stretchable board can achieve mechanically bendable and stretchable by using the elastomer based substrate and interconnect. Hence, the study on mechanical properties of substrate effec...
| Main Author: | Lee, Mei Wen |
|---|---|
| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2017
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/54399/ http://eprints.usm.my/54399/1/Stress%20Analysis%20Of%20Stretchable%20Thermal%20Sensor_Lee%20Mei%20Wen_2017.pdf |
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