Structural And Reliability Analysis Of Solder Joint Under Vibration Loading

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Structural And Reliability Analysis Of Solder Joint Under Vibration Loading

Most of the devices nowadays contained electronic parts and often operated in vibration environment for extended periods without failing. The role of solder in electronic packages has expanded and act as electrical interconnection as well as mechanical bond to certain parts while the joint decreas...

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Bibliographic Details
Main Author:	Ilias, Muhammad Ikmal
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2018
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/54367/ http://eprints.usm.my/54367/1/Structural%20And%20Reliability%20Analysis%20Of%20Solder%20Joint%20Under%20Vibration%20Loading_Muhammad%20Ikmal%20Ilias_M4_2018.pdf

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