Influence Of Material Properties On The Aperture Filling During Stencil Printing Process

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Influence Of Material Properties On The Aperture Filling During Stencil Printing Process

High requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger...

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Bibliographic Details
Main Author:	Mohamad Rafdzi, Muhammad Farid
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2018
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/54299/ http://eprints.usm.my/54299/1/Influence%20Of%20Material%20Properties%20On%20The%20Aperture%20Filling%20During%20Stencil%20Printing%20Process_Muhammad%20Farid%20Mohamad%20Rafdzi_M4_2018.pdf

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