Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles
The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, th...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54245/ http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf |
| _version_ | 1848882750453448704 |
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| author | Zulkurnain, Amru |
| author_facet | Zulkurnain, Amru |
| author_sort | Zulkurnain, Amru |
| building | USM Institutional Repository |
| collection | Online Access |
| description | The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device.
Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, the reliability and sustainability of the integrated circuit (IC) is improved. The introduction of higher amount of filler particles in the encapsulant in turn increasing the filling time of the underfilling process significantly. It has been found that the higher filler loading causing the encapsulant to become more viscous. In this research, straight forward solution to this is by incorporating additional energy during the underfilling process. In this research, simulation and experimental analysis is conducted to study the effect of thermal energy to the filling time of composite underfilling time at different filler loading. For simulation, finite volume method (FVM) based numerical solver using discrete phase model (DPM). From simulation and experimental results, it is proven that the thermal energy is able to reduce the filling time of the underfilling process between difference filler loading by average of 5%. |
| first_indexed | 2025-11-15T18:39:53Z |
| format | Monograph |
| id | usm-54245 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:39:53Z |
| publishDate | 2018 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-542452022-08-23T09:20:49Z http://eprints.usm.my/54245/ Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles Zulkurnain, Amru T Technology TJ Mechanical engineering and machinery The advance composite encapsulant with reinforce filler particle in the epoxy resin is a revolutionary advancement in the effort to improve the reliability of the electronic device. Many researches have been shown that by increase the amount of the filler particles in the composite encapsulant, the reliability and sustainability of the integrated circuit (IC) is improved. The introduction of higher amount of filler particles in the encapsulant in turn increasing the filling time of the underfilling process significantly. It has been found that the higher filler loading causing the encapsulant to become more viscous. In this research, straight forward solution to this is by incorporating additional energy during the underfilling process. In this research, simulation and experimental analysis is conducted to study the effect of thermal energy to the filling time of composite underfilling time at different filler loading. For simulation, finite volume method (FVM) based numerical solver using discrete phase model (DPM). From simulation and experimental results, it is proven that the thermal energy is able to reduce the filling time of the underfilling process between difference filler loading by average of 5%. Universiti Sains Malaysia 2018-05-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf Zulkurnain, Amru (2018) Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted) |
| spellingShingle | T Technology TJ Mechanical engineering and machinery Zulkurnain, Amru Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title | Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title_full | Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title_fullStr | Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title_full_unstemmed | Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title_short | Effect Of Thermal Energy On The Filling Time Of Composite Encapsulant Underfilling Process With Various Filler Loading Of Nano Silica Filler Particles |
| title_sort | effect of thermal energy on the filling time of composite encapsulant underfilling process with various filler loading of nano silica filler particles |
| topic | T Technology TJ Mechanical engineering and machinery |
| url | http://eprints.usm.my/54245/ http://eprints.usm.my/54245/1/Effect%20Of%20Thermal%20Energy%20On%20The%20Filling%20Time%20Of%20Composite%20Encapsulant%20Underfilling%20Process%20With%20Various%20Filler%20Loading%20Of%20Nano%20Silica%20Filler%20Particles_Amru%20Zulkurnain_M4_2018.pdf |