Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process

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Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process

High demands on flexibility, lighter weight, thinner size and low cost electronic product had increases the application of Flexible Printed Circuit Board (FPCB) over Rigid Printed Circuit Board (RPCB). However, thermal factor affects significantly on FPCB during reflow soldering process. Temperature...

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Bibliographic Details
Main Author:	Muhammad Rafiq, Mohammad Sabri
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2018
Subjects:	T Technology TJ Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/54244/ http://eprints.usm.my/54244/1/Effect%20Of%20Temperature%20On%20Flexible%20Printed%20Circuit%20Board%20During%20Reflow%20Soldering%20Process_Muhammad%20Rafiq%20Mohammad%20Sabri_M4_2018.pdf

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