APA (7th ed.) Citation

Muhammad Rafiq, M. S. (2018). Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process. Universiti Sains Malaysia.

Chicago Style (17th ed.) Citation

Muhammad Rafiq, Mohammad Sabri. Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process. Universiti Sains Malaysia, 2018.

MLA (9th ed.) Citation

Muhammad Rafiq, Mohammad Sabri. Effect Of Temperature On Flexible Printed Circuit Board During Reflow Soldering Process. Universiti Sains Malaysia, 2018.

Warning: These citations may not always be 100% accurate.