Design And Fabrication Of Spin Coating System For 8-Inch Wafer

Design And Fabrication Of Spin Coating System For 8-Inch Wafer

The size of the silicon wafer has been increased from 100 mm to 200 mm in diameter. The transition of the wafer into bigger size is due to overall cost benefits resulting from the larger number of dice per wafer. Growing in chip size and growing of demand also reasons the transition wafer into the...

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Bibliographic Details
Main Author: Teoh, Chin Keng
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54170/
http://eprints.usm.my/54170/1/Design%20And%20Fabrication%20Of%20Spin%20Coating%20System%20For%208-Inch%20Wafer_Teoh%20Chin%20Keng_M4_2018.pdf

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