Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin
In the modern semiconductor manufacturing processes, chemical mechanical polishing (CMP) has grown to be an essential part of the production of integrated circuit (IC) manufacturing. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mec...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54099/ http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf |
| _version_ | 1848882709595684864 |
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| author | Shamshuddin Jaya, Haslina |
| author_facet | Shamshuddin Jaya, Haslina |
| author_sort | Shamshuddin Jaya, Haslina |
| building | USM Institutional Repository |
| collection | Online Access |
| description | In the modern semiconductor manufacturing processes, chemical mechanical polishing (CMP) has grown to be an essential part of the production of integrated circuit (IC) manufacturing. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. Ion exchange process is used extremely for the removal of ionized impurities with proper resin selection. Therefore, ion exchange is one of the options to remove the heavy metal from spent slurry and to achieve environmental benefits that arise from the removal. The aim of this research is to study the removal mechanisms of tungsten, W, as a typical microelectronic metal under different resin loadings. Furthermore, surface analysis techniques which are scanning electron microscope (SEM) analysis and energy dispersive X-Ray (EDX) analysis were performed to study the characterization of the mixed bed resin with the CMP spent slurry. Concentration of tungsten removal was evaluated using inductively coupled plasma mass spectrometer (ICP-MS) by varying the amount of Dowex monosphere MR-450 UPW mixed
resin loadings (5g, 10g, 15g and 20g) at constant pH slurry under batch process. It is found that this mixed resin is effective to remove tungsten for more than 96% from spent tungsten CMP slurry at pH 3.87 ± 0.02. However, the removal percentage decreases from 98% to 96% as the resin loadings amount increases due to an increase in the availability of more sorption sites. Optimum resin loading was found to be 5g for 100 mL of spent slurry as it give the highest removal of tungsten which is 98%. |
| first_indexed | 2025-11-15T18:39:14Z |
| format | Monograph |
| id | usm-54099 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T18:39:14Z |
| publishDate | 2018 |
| publisher | Universiti Sains Malaysia |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-540992022-08-15T09:03:25Z http://eprints.usm.my/54099/ Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin Shamshuddin Jaya, Haslina T Technology TP Chemical Technology In the modern semiconductor manufacturing processes, chemical mechanical polishing (CMP) has grown to be an essential part of the production of integrated circuit (IC) manufacturing. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. Ion exchange process is used extremely for the removal of ionized impurities with proper resin selection. Therefore, ion exchange is one of the options to remove the heavy metal from spent slurry and to achieve environmental benefits that arise from the removal. The aim of this research is to study the removal mechanisms of tungsten, W, as a typical microelectronic metal under different resin loadings. Furthermore, surface analysis techniques which are scanning electron microscope (SEM) analysis and energy dispersive X-Ray (EDX) analysis were performed to study the characterization of the mixed bed resin with the CMP spent slurry. Concentration of tungsten removal was evaluated using inductively coupled plasma mass spectrometer (ICP-MS) by varying the amount of Dowex monosphere MR-450 UPW mixed resin loadings (5g, 10g, 15g and 20g) at constant pH slurry under batch process. It is found that this mixed resin is effective to remove tungsten for more than 96% from spent tungsten CMP slurry at pH 3.87 ± 0.02. However, the removal percentage decreases from 98% to 96% as the resin loadings amount increases due to an increase in the availability of more sorption sites. Optimum resin loading was found to be 5g for 100 mL of spent slurry as it give the highest removal of tungsten which is 98%. Universiti Sains Malaysia 2018-06-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf Shamshuddin Jaya, Haslina (2018) Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Kimia. (Submitted) |
| spellingShingle | T Technology TP Chemical Technology Shamshuddin Jaya, Haslina Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title | Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title_full | Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title_fullStr | Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title_full_unstemmed | Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title_short | Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin |
| title_sort | tungsten removal from chemical mechanical polishing (cmp) spent slurry using dowex monosphere mr-450 ultrapure water (upw) resin |
| topic | T Technology TP Chemical Technology |
| url | http://eprints.usm.my/54099/ http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf |