Influence Of Squeegee Impact On Stencil Printing Process- CFD Approach

Influence Of Squeegee Impact On Stencil Printing Process- CFD Approach

High requirement of smaller size, lighter weight, and high performance PCB in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger process output at short ti...

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Bibliographic Details
Main Author: Samad, Mohd Hazim Sadiq Abd
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/53723/
http://eprints.usm.my/53723/1/Influence%20Of%20Squeegee%20Impact%20On%20Stencil%20Printing%20Process-%20CFD%20Approach_Mohd%20Hazim%20Sadiq%20Abd%20Samad_M4_2017.pdf

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