Microstructure Evolution Of Isothermally Aged Ecaped Sac Solder Alloy

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Microstructure Evolution Of Isothermally Aged Ecaped Sac Solder Alloy

In recent years, Sn-Ag-Cu solder alloy has been found to be amongst the suitable candidate for replacement of the conventional tin-lead (Sn-Pb) solder. Despite the advantages of SAC solder, the current demand of interconnect material prefers a higher mechanical properties of solder which would provi...

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Bibliographic Details
Main Author:	Zulkifli, Nur Amiera
Format:	Monograph
Language:	English
Published:	Universiti Sains Malaysia 2017
Subjects:	T Technology TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.usm.my/52552/ http://eprints.usm.my/52552/1/Microstructure%20Evolution%20Of%20Isothermally%20Aged%20Ecaped%20Sac%20Solder%20Alloy_Nur%20Amiera%20Zulkifli_B1_2017.pdf

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