Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy

Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy

For several years, Sn-0.7Cu solder has been used in electronic packaging industries to replace the Sn-Pb solder in order to reduce the negative impact of lead to the environment and human health. However, the relatively poor wettability and mechanical properties of Sn-Cu solder alloys has raised...

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Bibliographic Details
Main Author: Tan, Joo Kean
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:http://eprints.usm.my/52435/
http://eprints.usm.my/52435/1/Effect%20Of%20Adding%20Indium%20And%20Zinc%20Alloying%20Elements%20To%20Creep%20Behavior%20Of%20Sn-0.7cu%20Solder%20Alloy_Tan%20Joo%20Kean_B1_2017.pdf

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