Tan, J. K. (2017). Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy. Universiti Sains Malaysia.
Chicago Style (17th ed.) CitationTan, Joo Kean. Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy. Universiti Sains Malaysia, 2017.
MLA (9th ed.) CitationTan, Joo Kean. Effect Of Adding Indium And Zinc Alloying Elements To Creep Behavior Of Sn-0.7cu Solder Alloy. Universiti Sains Malaysia, 2017.
Warning: These citations may not always be 100% accurate.