An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

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An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important...

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Bibliographic Details
Main Author:	Lim, Thai Li
Format:	Thesis
Language:	English
Published:	2019
Subjects:	T Technology TK Electrical Engineering. Electronics. Nuclear Engineering
Online Access:	http://eprints.usm.my/50617/ http://eprints.usm.my/50617/1/An%20Optical%20Set-Up%20For%20Inspecting%20Edge%20Chipping%20Defects%20Of%20Dws%20Solar%20Wafer.pdf

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