Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions

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Characterization and corrosion behaviour of 96.5Sn-3.0Ag-0.5Cu solder on Cu substrate at different reflow reactions

96.5Sn-3.0Ag-0.5Cu (SAC305) thin film solder exhibits different surface characteristics if compared to conventional bulk solder. In thin film solder, the actual surface is comprised of intermetallic layers whereas in the case of conventional solder, the intermetallic layers happened at the interfaci...

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Bibliographic Details
Main Author:	Lee, Liu Mei
Format:	Thesis
Language:	English
Published:	2013
Subjects:	TN1-997 Mining engineering. Metallurgy
Online Access:	http://eprints.usm.my/48025/ http://eprints.usm.my/48025/1/characterization%20and%20corrosion%20behaviour24.pdf

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