Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging

Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging

This thesis presents the thermal impact of thermal interface material 1 (TIM1) and heat spreader co-planarity to the flip chip package with heat spreader. The TIM1 material influences the efficiency of heat transfer from silicon die to the heat spreader while the co-planarity of heat spreader affect...

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Bibliographic Details
Main Author: Pang, Shi Shiang
Format: Thesis
Language:English
Published: 2020
Subjects:
T Technology
Online Access:http://eprints.usm.my/47762/
http://eprints.usm.my/47762/1/Thermal%20Impact%20Of%20Thermal%20Interface%20Materials%20And%20Heat%20Spreader%20Co-Planarity%20Of%20The%20Electronic%20Packaging.pdf

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