APA (7th ed.) Citation

Pang, S. S. (2020). Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging.

Chicago Style (17th ed.) Citation

Pang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.

MLA (9th ed.) Citation

Pang, Shi Shiang. Thermal Impact Of Thermal Interface Materials And Heat Spreader Co-Planarity Of The Electronic Packaging. 2020.

Warning: These citations may not always be 100% accurate.