Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape

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Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape

The influence of substrate copper density distribution, substrate bump coplanarity, stiffener attach process, and substrate clamping by magnetic boat during die attach towards Flip Chip Ball Grid Array (FCBGA) assembled package warpage were evaluated. The substrate warpage behavior throughout the...

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Bibliographic Details
Main Author:	Lim, Shaw Fa
Format:	Thesis
Language:	English
Published:	2020
Subjects:	T Technology TJ1-1570 Mechanical engineering and machinery
Online Access:	http://eprints.usm.my/47543/ http://eprints.usm.my/47543/1/Warpage%20Behavior%20Of%20Thin%20Fcbga%20Package%20And%20Prediction%20Of%20Its%20First%20Interconnect%20Snag%20Solder%20Joint%20Shape.pdf

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