Lim, S. F. (2020). Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape.
Chicago Style (17th ed.) CitationLim, Shaw Fa. Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape. 2020.
MLA (9th ed.) CitationLim, Shaw Fa. Warpage Behavior Of Thin Fcbga Package And Prediction Of Its First Interconnect Snag Solder Joint Shape. 2020.
Warning: These citations may not always be 100% accurate.