Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method

The increased in input/output (I/O) density due to the demand of high performances in devices caused the routing density on printed circuit board increased. This caused the board size increases due to the increased of trace width and trace spacing. Apart from that, the consumers preferred a small...

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Bibliographic Details
Main Author: Yusop, Nurul Khalidah
Format: Thesis
Language:English
Published: 2017
Subjects:
T Technology
Online Access:http://eprints.usm.my/47315/
http://eprints.usm.my/47315/1/Surface%20Morphology%20And%20Electrical%20Properties%20Of%20Copper-Nickel%20Alloy%20Thin%20Film%20Deposited%20On%20Printed%20Circuit%20Board%20Using%20Thermal%20Evaporation%20Method.pdf

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