Yusop, N. K. (2017). Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method.
Chicago Style (17th ed.) CitationYusop, Nurul Khalidah. Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method. 2017.
MLA (9th ed.) CitationYusop, Nurul Khalidah. Surface Morphology And Electrical Properties Of Copper-Nickel Alloy Thin Film Deposited On Printed Circuit Board Using Thermal Evaporation Method. 2017.
Warning: These citations may not always be 100% accurate.