Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate

Effect Of Zn Addition On Microstructure, Intermetallic Compound Formation And Mechanical Properties Of Sn-0.7cu Solder On Cu Substrate

Solder joints serve as both electronic and mechanical connections between components as well as substrates in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. An attractive candidate is Sn-Cu...

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Bibliographic Details
Main Author: Ghani, Fitriah Abdul
Format: Thesis
Language:English
Published: 2018
Subjects:
T Technology (General)
TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:http://eprints.usm.my/47290/
http://eprints.usm.my/47290/1/Effect%20Of%20Zn%20Addition%20On%20Microstructure%2C%20Intermetallic%20Compound%20Formation%20And%20Mechanical%20Properties%20Of%20Sn-0.7cu%20Solder%20On%20Cu%20Substrate.pdf

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