Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. Howev...

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Bibliographic Details
Main Author: Lim, Chong Hooi
Format: Thesis
Language:English
Published: 2017
Subjects:
T Technology
TJ1-1570 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/46933/
http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf

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